TSMC and GlobalFoundries: How a $2 Billion Deal Could Reshape America’s Advanced Packaging Supply Chain
· Source: tspasemiconductor.substack.com
In short
TSMC and GlobalFoundries have announced a $2 billion manufacturing agreement under which GlobalFoundries will produce silicon interposers for TSMC’s CoWoS advanced packaging ecosystem, beginning volume production in the first half of 2028. This partnership between competitors highlights a shift in the semiconductor supply chain towards a distributed network of specialized suppliers and addresses the growing complexity of AI processor packaging beyond transistor miniaturization.
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In the issue of week 41, 2026: AI Moves Supply Chains From Planning Toward Execution, But Data and Capacity Set the Pace
Tags: semiconductors, packaging, supply chain, manufacturing, AI processors, partnership