GlobalFoundries Lands $2 Billion TSMC Order, Establishing First US CoWoS Interposer Capacity
· Source: biggo.com
In short
GlobalFoundries has signed a multi-year agreement with TSMC worth roughly $2 billion to supply silicon interposers for TSMC's CoWoS advanced packaging ecosystem from its Malta, New York fab, making it the first US-based supplier of the critical component. Volume production is expected to ramp in the first half of 2028 under an initial five-year term, with GlobalFoundries shares up about 4% pre-market. The deal extends AI chip supply chain localization from wafer fabrication into advanced packaging, where CoWoS capacity remains a key bottleneck limiting AI accelerator deliveries from Nvidia and AMD.
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In the issue of week 41, 2026: AI Moves Supply Chains From Planning Toward Execution, But Data and Capacity Set the Pace
Tags: semiconductors, packaging, supply chain, CoWoS, foundry, chips