AMD’s Lisa Su Visits TSMC, AI Supply Chain Partners as Company Locks In Capacity 3–5 Years Ahead
· Source: trendforce.com
In short
AMD Chair and CEO Lisa Su visited Taiwan to engage with TSMC and other AI supply chain partners as AMD plans significant capacity expansion for its AI-related products over the next 3 to 5 years. The company is ramping production of next-generation AI platforms, including the MI450 and MI455 series, supported by advanced packaging technologies like CoWoS and Fan-Out PLP. AMD is also securing memory supplies from South Korean manufacturers to support this growth.
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In the issue of week 41, 2026: AI Moves Supply Chains From Planning Toward Execution, But Data and Capacity Set the Pace
Tags: AI, capacity, TSMC, AMD, packaging, supplychain