US Advanced Semiconductor Packaging Market - Size, Strategic Insights, and Forecasts, 2026-2031 | AI, 5G, CHIPS Act, and Reshoring Drive Growth to USD 11.7 Billion
· Source: supplychaindigital.com
In short
The US advanced semiconductor packaging market is forecasted to grow from USD 9.6 billion in 2026 to USD 11.7 billion by 2031, driven by demand in AI, 5G, automotive, and other sectors. Supportive policies like the CHIPS Act and reshoring efforts are accelerating domestic investment and reducing supply chain risks. Key packaging types include flip-chip, fan-out wafer-level packaging, and embedded die, serving applications in consumer electronics, automotive, and telecommunications.
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Tags: semiconductor, packaging, CHIPS Act, 5G, AI, reshoring