TSMC taps U.S. interposers to speed AI chip packaging shift, pressure Korea - CHOSUNBIZ
· Source: biz.chosun.com
In short
TSMC is accelerating localization of its AI semiconductor manufacturing by securing silicon interposers from the U.S., signing a $2 billion contract with GLOBALFOUNDRIES to produce these components in New York starting in 2028. This move supports TSMC's strategy to expand AI chip production in the U.S. and pressures Korean HBM suppliers to localize their packaging as well.
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Tags: semiconductor, packaging, supply chain, localization, interposer, TSMC