AMD's Lisa Su Makes Whirlwind Taiwan Visit to Lock in Capacity, Reportedly Meets TSMC and Top Server ODMs — BigGo Finance
· Source: finance.biggo.com
In short
AMD CEO Lisa Su visited Taiwan on October 6 to secure advanced process, packaging, and substrate capacity for 2027 and 2028 to ensure shipments of next-generation AI server products. Her meetings with Taiwan Semiconductor Manufacturing and major ODMs focused on mitigating supply bottlenecks in memory and packaging integration. Following Taiwan, she plans to visit South Korea to discuss high-bandwidth memory cooperation with Samsung as AMD aims to expand AI server production amid strong demand exceeding supply.
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In the issue of week 41, 2026: AI Moves Supply Chains From Planning Toward Execution, But Data and Capacity Set the Pace
Tags: supply chain, capacity, AI servers, packaging, HBM memory, semiconductors