GlobalFoundries Wins $2B TSMC Pact to Build First US Interposer Supply for AI Chips
· Source: techtimes.com
In short
GlobalFoundries has signed a $2 billion, five-year agreement with TSMC to produce silicon interposers at its Malta, New York facility, establishing the first US supply of this key component for TSMC's CoWoS advanced AI chip packaging. Production is expected to ramp up in the first half of 2028, addressing an upstream supply gap while full CoWoS packaging remains concentrated in Taiwan until 2028–2029. The deal marks a significant step toward a domestic AI chip packaging supply chain but does not yet complete it.
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Tags: interposer, packaging, chips, CoWoS, AI, supplychain