Samsung Electro-Mechanics and NVIDIA Announce Strategic Partnership to Supply ABF Substrates
· Source: tradingview.com
In short
Samsung Electro-Mechanics and NVIDIA have formed a strategic partnership to expand dedicated ABF package substrate production in Sejong and Busan, South Korea, with supply beginning in 2026. The multi-year agreement aims to secure advanced substrates for next-generation AI processors and high-speed networking switches, helping ease AI infrastructure supply chain bottlenecks. NVIDIA-allocated output is expected to grow at a double-digit annual rate and represent a significant share of Samsung Electro-Mechanics' substrate capacity by 2028.
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Tags: supply chain, semiconductors, substrates, advanced packaging, AI infrastructure, manufacturing