2026 IMAPCT | AI Packaging’s Next Materials Bottleneck: Ajinomoto Unveils Advanced ABF Technologies
· Source: tspasemiconductor.substack.com
In short
Ajinomoto, originally known for its food business, plays a crucial role in the AI semiconductor supply chain by advancing Ajinomoto Build-up Film (ABF) technologies. These innovations address signal integrity, power management, and mechanical reliability in semiconductor packaging, but the supply of ABF is becoming a bottleneck amid rising AI demand. Taiwanese company WaferChem is developing a local alternative to reduce dependence on Japanese suppliers and enhance supply flexibility.
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Tags: semiconductor, packaging, ABF, materials, supply chain, AI chips