AUO Chairman Paul Peng: Glass substrates to mature in 2–3 years, entering AI advanced packaging supply chain — BigGo Finance
· Source: finance.biggo.com
In short
AUO plans to leverage its 30 years of glass processing expertise to enter the AI chip advanced packaging supply chain, focusing on supplying glass substrates and related processes. The company aims for glass substrate technology to mature in 2-3 years with initial small-volume shipments, targeting the next generation of advanced packaging driven by the needs of larger AI chips. AUO's subsidiary now derives all revenue from semiconductor operations, aiming to reduce pure panel revenue to 30% by 2030, while major industry players like Intel and TSMC also advance glass substrate developments.
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Tags: glass, substrates, packaging, semiconductor, micro LED, advanced packaging