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The Global Chip Manufacturing Landscape: How Advanced Technologies and Supply Chain Shifts Are Reshaping the Entire Semiconductor Industry

· Source: eu.36kr.com

In short

The article examines how surging AI compute demand is disrupting the semiconductor industry’s traditional division of labor across design, foundry, packaging, substrates and testing. It details capacity prepayments, cross-competitor manufacturing agreements and closer collaboration between foundries and OSATs as companies seek to secure advanced packaging and HBM-related capacity. It also shows how AI and accelerated computing are entering process development, lithography, inspection and fab optimization, making supply chain coordination more integrated.

Read Original Article — Read the full article on the publisher’s site.

In the issue of week 44, 2026: Warehouse AI now has live throughput proof: Aeon reports loading doubled at Saitama

Tags: semiconductors, supply chain, advanced packaging, manufacturing, AI chips, foundries

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