AI disruption forces $100 billion inflection point in advanced chip packaging as supply constraints intensify
· Source: dqindia.com
In short
AI and high-performance computing demand are pushing advanced chip packaging to a historic inflection point, with global VC investment in AI surpassing $100 billion in 2024 and Asia-Pacific advanced packaging capacity growing roughly fourfold in under two years. TSMC's CoWoS capacity is largely booked through 2026, while governments in the U.S., China, South Korea, Japan and Europe pour billions into packaging self-sufficiency. Emerging technologies such as CoWoS, 2.5D/3D heterogeneous integration, HBM, photonic interconnects and panel-level packaging are redefining performance boundaries.
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In the issue of week 40, 2026: Supply Chain AI Advances, but Data, Governance and Capacity Set the Pace
Tags: semiconductors, packaging, supply-chain, chips, investment, hbm